Purge-Atory Purging Compound

Purge-Atory is a revolutionary heavy-duty purging compound recommended forb use with gas emitting resins such as Delrin® and acetal. Requires no mixing or preparation time. Operating temperatures ranging from 370° – 610°F/187°C – 321°C. Formulated with a SAN resin carrier, Purge-Atory is safe to purge right through the mold, saving time, material and money. All ingredients are GRAS rated so it is safe to use for food packaging applications. For use with injection molding, extrusion and blow molding.
470-50 (50-lb. box)
470-1000 (1000-lb. gaylord)